Wafer dicing, substrate dicing and wafer backgrinding
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Precision Wafer Dicing and Wafer BackgrindingPrecision wafer dicing services are provided for prototype and high volume dicing requirements. All dicing saws are fully programmable and equipped with high magnification optics for precision alignment.Partial cut and break services are offered or 100% saw through on tape or other carrier. ESD protection available when required. Precision Wafer Dicing Request for QuotationWafer and substrate dicing services for of standard materials like glass, quartz and silicon or need to develop dicing and cutting procedures for untried materials, Engineering will work with you to achieve your quality and product goals. Required wafer dicing information:
Precision Wafer dicing Web sites:
Return to Home Page: Fused silica and fused quartz substrates, wafers and disks
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Valley Design East
Phoenix Park Business Center 2 Shaker Road, Bldg. E-001 Shirley, MA 01464 Phone: 978.425.3030 Fax: 978.425.3031 Valley Design West Santa Cruz, CA 95060 Phone: 831.420.0595 Fax: 831.420.0592 |